Reference number
ISO/TS 10303-1698:2018
Technical Specification
ISO/TS 10303-1698:2018
Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design
Edition 6
2018-11
Technical Specification
Read sample
ISO/TS 10303-1698:2018
76243
Published (Edition 6, 2018)
This publication was last reviewed and confirmed in 2022. Therefore this version remains current.

Abstract

ISO/TS 10303-1700:2018-11 specifies the application module for Layered interconnect module with printed component design.

The following are within the scope of ISO/TS 10303-1700:2018-11:

  • printed components;
  • routed printed components;
  • printed connectors;
  • items within the scope of application module Land, ISO/TS 10303-1692;
  • items within the scope of application module Printed physical layout template, ISO/TS 10303-1737.

General information

  •  : Published
     : 2018-11
    : International Standard confirmed [90.93]
  •  : 6
     : 11
  • ISO/TC 184/SC 4
    25.040.40 
  • RSS updates

Add to cart this standard

This collection is a standard for the exchange of product model data (STEP) module and resource library (SMRL). It is intended for those who are considering adopting ISO 10303 modular application protocols, application modules, and resource parts, or systems built on them, for product data representation …

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