ISO/TS 10303-1685:2014
Industrial automation systems and integration — Product data representation and exchange — Part 1685: Application module: Interconnect module to assembly module relationship
Reference number
ISO/TS 10303-1685:2014
Edición 3
2014-06
© ISO 2024
Retirada
Retirada (Edición 3, 2014)

Resumen

ISO/TS 10303-1685:2014-02 specifies the application module for Interconnect module to assembly module relationship.

The following are within the scope of ISO/TS 10303-1685:2014-02:

  • assembly requirement for interconnect substrate;
  • assembly component based symbol placement in substrate requirement;
  • assembly component based annotation text placement in substrate requirement;
  • assembly component feature to layout feature requirement relationship;
  • external references for assembly component;
  • external references for assembly component feature;

Informaciones generales

  • Estado
     : Retirada
    Fecha de publicación
     : 2014-06
    Etapa
    : Retirada de la Norma Internacional [95.99]
  • Edición
     : 3
    Número de páginas
     : 11
  • Comité Técnico :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
  • RSS actualizaciones

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