Текущий статус : Отозвано

Это стандарт пересмотренISO/TS 10303-1649:2010

Тезис

ISO/TS 10303-1649:2006 specifies the application module for Assembly technology.

ISO/TS 10303-1649:2006 deals with the representation of the information needed to describe the different aspects of how components are joined together to make an assembly. ISO/TS 10303-1649:2006 defines the information needed to describe the material used in making the physical connections and their typical shape. ISO/TS 10303-1649:2006 is foundational for verification and validation that the actual design meets detailed functional specifications by providing a mechanism for a design organization to make explicit assertions about the detailed joints that are implemented in the physical design.

The following are within the scope of ISO/TS 10303-1649:2006:

  • bonds between components in an assembly;
  • bond shape definition;
  • bonds based on solder or adhesive;
  • bonds based on discrete fasteners;
  • component mating conditions characterization.

Общая информация

  • Текущий статус
     : Отозвано
    Дата публикации
     : 2006-12
    Этап
    : Отмена международного стандарта [95.99]
  • Версия
     : 1
  • Технический комитет :
    ISO/TC 184/SC 4
    ICS :
    25.040.40 
  • RSS обновления

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  2. Интернет-магазин
  3. Каталог стандартов
  4. ТК
  5. ISO/TC 184/SC 4
  6. ISO/TS 10303-1649:2006